Pembersih Plating Nikel ATPN dengan kemurnian 98% S-Carboxyethylisothiuronium Betaine cas:5398-29-8
ATPN Nikel Plating Brightener
,S-Carboxyethylisothiuronium Betaine Nikel Plating Brightener
,98% kemurnian Nikel Plating Brightener
Perantara kimia perpaduan nikel ATPN CAS 5398-29-8
CAS: 5398-29-8
Agen toleransi kekotoran dalam plating Nikel
Sertifikat ISO, REACH
Informasi produk:
| Nama produk | 3-Isothioureidopropionic acid (Agen toleransi kekotoran ATPN) |
|---|---|
| Sinonim | 3-Isothioureidopropionic acid; S-Carboxyethylisothiuronium betaine; Carboxyethylisothiuronium betaine; 3-Amidinothio) propionic acid; 3-carbamididoylsulfanylpropanoic acid;3- ((aminoiminomethyl) thiopropanoic acid; ATPN |
| Nomor registrasi CAS | 5398-29-8 |
| Rumus Molekuler | C4H8N2O2S |
| Berat Molekul | 148.18 |
| Struktur Molekuler |
Karakteristik:
| Artikel | Deskripsi |
| Penampilan | Bubuk kristal putih |
| Periksa | 98% |
| Konsentrasi dalam bak mandi | 1-10mg/L |
| Konsumsi ((g/KAH) | 1.5 |
| Kondisi penyimpanan | Simpan di tempat yang dingin dan kering |
* Kualitas dikontrol ketat di bawah sistem ISO, dengan stabilitas kimia yang sangat baik.
Aplikasi utama:
Bahan kimia perantara;
Agen toleransi kekotoran untuk plating Nikel,bisa meningkatkan daya penutupdi daerah arus rendah.
Paket: 5 kg karton atau 25 kg drum serat
Daftar produk kami:
| Bahan Kimia Nickel Plating | ||
| Pencerahan dan agen leveling yang tahan lama | BOZ, BEO, BMP... | |
| Pencerahan cepat dan agen leveling | PA, PAP, PME.. | |
| Agen leveling yang lebih terang dan kuat/tertahan | DEP, PABS, TC-DEP.. | |
| Agen penghalusan yang lebih kuat | PPS, PPS-OH.. | |
| Bantuan & Asisten brightener | ALS, VS, EHS, BBI.. | |
| Toleransi terhadap Kekotoran | ATPN, SSO3, PN | |
| Agen yang lebih terang dan merata pada area cahaya rendah | POPDH, PS, POPS,.. | |
| Agen pembasmian busa rendah | TC-EHS | |
| Sedikit terang | HD-M, TCA, .. | |
| Bahan kimia zinc plating | ||
| Plating Asam Seng | BAR, OCBA, | |
| Pengecoran Seng Alkalin | WT/PUB. BPC-48, DPE,IMZE,H1 | |
| Bahan Kimia Lapisan Tembaga | ||
| Lapisan Tembaga Asam | SPS, M, H1, P-6000, UPS, DPS, ZPS, MPS | |
| Plating Cu tanpa elektro | EDTP (Q75) | |
| Bahan kimia halus: | ||
| 3-Chloro-2-hydroxypropanesulfonic acid, garam natrium (CAS No. 126-83-0), 1,3-Propane Sultone, 1,4-Butane Sultone, Propargyl Chloride, Phenazine, M-Nitrobenzene Sulfonate, | ||
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